| 阳极键合强度及其评价方法 |
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| 引用本文： | 曹欣,李宏,杜芸.阳极键合强度及其评价方法[J].传感器与微系统,2007,26(3):10-12,16. |
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| 作者姓名： | 曹欣 李宏 杜芸 |
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| 作者单位： | 武汉理工大学,硅酸盐材料教育部重点实验室,湖北,武汉,430070 |
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| 基金项目： | 国家自然科学基金
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湖北省自然科学基金 |
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| 摘 要： | 阳极键合作为一种在微机电系统(MEMS)中运用的关键技术,具有工艺简单、键合强度高、密封性好等优点。经过几十年的发展,该技术在键合机理和提高与评价键合强度等诸多方面都得到了很大的发展,并应用于越来越多的领域。对阳极键合技术的机理、键合基片材料的发展以及键合强度的评价方法等方面进行了综述和评价,并对阳极键合技术在MEMS中的发展趋势作出展望。
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| 关 键 词： | 阳极键合 键合强度 玻璃 硅片 评价方法 |
| 文章编号： | 1000-9787（2007）03-0010-03 |
| 修稿时间： | 2006-12-12 |
Anodic bonding strength and its evaluation |
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| CAO Xing,LI Hong,DU Yun.Anodic bonding strength and its evaluation[J].Transducer and Microsystem Technology,2007,26(3):10-12,16. |
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| Authors: | CAO Xing LI Hong DU Yun |
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| Affiliation: | Key Laboratory of Ceramics Materials, Ministry of Education, Wuhan University, Wuhan 430070, China |
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| Abstract: | Anodic bonding is the key technology of MEMS. This kind of technology has some advantages, such as simply technics, higher bonding strength, the good capability of airproof. For several decades, the technology has some improvement in mechanism of bonding and the measurement of bonding strength. The mechanism of bonding, material of improvement bonding and the evaluation method of bonding strength are summarized. The development of this technology which used in MEMS is expected. |
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| Keywords: | anodic bonding bonding strength glass silicon evaluation method |
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