| T2铜薄板电磁微胀形成形(英文) |
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| 引用本文： | 赵庆娟,王春举,于海平,郭斌,单德彬,李春峰.T2铜薄板电磁微胀形成形(英文)[J].中国有色金属学会会刊,2011(Z2). |
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| 作者姓名： | 赵庆娟 王春举 于海平 郭斌 单德彬 李春峰 |
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| 作者单位： | 哈尔滨工业大学材料科学与工程学院; |
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| 基金项目： | Projects(50835002,50805035)supported by the National Natural Science Foundation of China |
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| 摘 要： | 对T2紫铜薄板进行电磁微胀形有模成形实验,研究不同电压及不同凹模深度对材料成形性能的影响。采用激光共聚焦显微镜及轮廓仪研究不同充电电压和不同凹模深度下的制件截面轮廓、成形深度的变化规律。研究结果表明:凹模深度一定,随着电压升高微通道成形精度不断提高,成形深度在7500V出现极值,随后制件表面逐渐出现反弹迹象,成形深度降低,表面质量下降;而当电压一定,随着凹模深度的减小,成形深度随之增加,微通道成形精度逐渐提高,在凹模深度为0.5mm时出现极值,随后精度逐渐降低,但随着凹模深度的降低制件表面的弹复现象逐渐减弱、排气不良留下的痕迹逐渐消失,表面质量不断提高。
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| 关 键 词： | 薄板 微成形 微胀形 电磁成形 |
Micro bulging of thin T2 copper sheet by electromagnetic forming |
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| ZHAO Qing-juan,WANG Chun-ju,YU Hai-ping,GUO Bin,SHAN De-bin,LI Chun-feng School of Materials Science , Engineering,Harbin Institute of Technology,Harbin ,China.Micro bulging of thin T2 copper sheet by electromagnetic forming[J].Transactions of Nonferrous Metals Society of China,2011(Z2). |
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| Authors: | ZHAO Qing-juan WANG Chun-ju YU Hai-ping GUO Bin SHAN De-bin LI Chun-feng School of Materials Science Engineering Harbin Institute of Technology Harbin China |
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| Affiliation: | ZHAO Qing-juan,WANG Chun-ju,YU Hai-ping,GUO Bin,SHAN De-bin,LI Chun-feng School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China |
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| Abstract: | Electromagnetic micro bulging experiments on T2 copper were achieved in order to find the effects that different voltages and depths of mold work on deformation characters. Laser scanning confocal microscope and contourgraph were used to study the effects of electromagnetic forming parameters such as voltage and die depth on material. Results show that width and depth of micro channel increase with the increases of voltage with a certain die depth, moreover, forming depth reaches the maximum at 7 500 V. And... |
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| Keywords: | sheet micro-forming micro bulging electromagnetic forming |
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