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Simulation and prediction in laser bending of silicon sheet
Authors:WANG Xu-yue  XU Wei-xing  XU Wen-ji  HU Ya-feng  LIANG Yan-de  WANG Lian-ji Key Laboratory for Precision  Non-traditional Machining Technology of the Ministry of Education  Dalian University of Technology  Dalian  China
Affiliation:WANG Xu-yue,XU Wei-xing,XU Wen-ji,HU Ya-feng,LIANG Yan-de,WANG Lian-ji Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116024,China
Abstract:The laser bending of single-crystal silicon sheet (0.2 mm in thickness) was investigated with JK701 Nd:YAG laser. The models were developed to describe the beam characteristics of pulsed laser. In order to simulate the process of laser bending, the FEM software ANSYS was used to predict the heat temperature and stress-strain fields. The periodic transformation of temperature field and stress-strain distribution was analyzed during pulsed laser scanning silicon sheet. The results indicate that the mechanism ...
Keywords:laser bending  silicon sheet  pulsed laser  simulation  
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