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Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging |
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| Affiliation: | 1. Department of Physics and Nanotechnology, Aalborg University, Skjernvej 4A, 9220 Aalborg, Denmark;2. Department of Mechatronics, University of Applied Sciences Kiel, Grenzstraße 5, 24149 Kiel, Germany |
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