埋入电容式多层印制板的研制

研究埋入电容多层板的制作工艺。通过试验验证电容容值与电容设计方法的关系,多层板生产流程中层压、热风整平工序对电容容值的影响;通过热冲击试验、老化试验等试验验证了埋入电容的容值在环境试验中的稳定性。通过一系列试验验证了埋入电容具有高温稳定性,可以在多层板内实现多个埋置电容层。可靠性试验证明埋置电容具有很好的稳定性和很高的可靠性。

Multilayer PCB of Embedded Capacitance Manufacture

Study the process of multilayer PCB of embedded capacitance. The relationship between capacitance and capacitance design method were verified though experiments, at same time, the effects of laminating and hot air leveling process on capacitance were also verified though experiments. The stability of capacitance in environmental test were verified though the thermal shock test and aging test. The embedded capacitor has high temperature stability were verified through a series of experiments. Design a plurality of embedded capacitor layer in the multilayer board is feasible. Reliability test proved that the embedded capacitor has good stability and high reliability.