| 半挠性印制电路板盲槽反控深揭盖工艺研究 |
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| 引用本文： | 陈志宇,唐德众.半挠性印制电路板盲槽反控深揭盖工艺研究[J].印制电路信息,2020(1):18-22. |
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| 作者姓名： | 陈志宇 唐德众 |
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| 作者单位： | 通元科技（惠州）有限公司 |
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| 摘 要： | 结合半挠性印制电路板的常规制作方法的优缺点,以铳槽揭盖法工艺为基础,导入盲槽反控深的方式,通过全流程制作实验板评估盲槽控深揭盖工艺应用于半挠性印制电路板的生产制作可行性,并对产品进行可靠性测试。
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| 关 键 词： | 半挠性印制电路板 半槽控深 揭盖 |
Research on technology of semi-flexible PCB blind slot controlled depth lid removing |
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| Chen Zhiyu,Tang Dezhong.Research on technology of semi-flexible PCB blind slot controlled depth lid removing[J].Printed Circuit Information,2020(1):18-22. |
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| Authors: | Chen Zhiyu Tang Dezhong |
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| Abstract: | This paper combines the advantages and disadvantages of the conventional manufacturing method of Semi-flex PCB, and introduces the method of blind slot control depth based on the lid removing method. Through the whole process production experimental board, it makes evaluation of blind slot controlled depth lid removing process applied to the production of Semi-flex PCB production feasibility, and product reliability testing. |
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| Keywords: | Semi-Flex PCB Depth-Controlled Milling Lid Removing |
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