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一款任意层互连HDI板制作及流程管控
引用本文:郭达文,何立发,谢圣林,查红平.一款任意层互连HDI板制作及流程管控[J].印制电路信息,2020(1):10-14.
作者姓名:郭达文  何立发  谢圣林  查红平
作者单位:红板(江西)有限公司
摘    要:任意层互连板是印制板中制作难度大、工艺技术水平高的一种。文章选取一款用于移动通信智能终端的任意互连板,对其流程制作和品质管控做了初步阐释,希望能给业界同行提供一定的参考。

关 键 词:高密度印制板  过程管控  任意层互连技术

Fabrication and process control of interconnected Any layer HDI Board
Guo Dawen,He Lifa,Xie Shenglin,Cha Hongping.Fabrication and process control of interconnected Any layer HDI Board[J].Printed Circuit Information,2020(1):10-14.
Authors:Guo Dawen  He Lifa  Xie Shenglin  Cha Hongping
Abstract:Mobile communication intelligent terminal PCB is a popular high-end PCB product.Any layer board is one of such PCB board production difficulties with high level technology.This paper chose an any layer board used for mobile communication intelligent terminal,and its process making and quality control were preliminarily explained,hoping to provide some reference for peers in the industry.
Keywords:HDI PCB  Process Control  Any Layer Interconnected
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