Wet chemical etching of silicate glasses in hydrofluoric acid based solutions

The etching of silicate glasses in aqueous hydrofluoric acid solutions is applied in many technological fields. In this review most of the aspects of the wet chemical etching process of silicate glasses are discussed. The mechanism of the dissolution reaction is governed by the adsorption of the two reactive species: HF and HF ₂ ^- and the catalytic action of H⁺ ions, resulting in the breakage of the siloxane bonds in the silicate network. The etch rate is determined by the composition of the etchant as well as by the glass, although the mechanism of dissolution is not influenced. In the second part of this review, diverse applications of etching glass objects in technology are described. Etching of SiO₂ and doped SiO₂ thin films, studied extensively for integrated circuit technology, is discussed separately.