一种高性能电磁式微机械振动环陀螺

模态匹配和高的品质因数是提高振动环陀螺性能的关键。设计制作了一种电磁式微机械振动环陀螺，采用了全对称的结构以实现模态匹配。通过理论推导建立了陀螺灵敏度和机械噪声的数学模型，分析了陀螺参数对灵敏度及分辨力的影响。采用（100）晶向的单晶硅及MEMS体硅标准工艺加工了陀螺样片，该工艺简单，无需键合。器件频响实验结果表明，所设计的振动环陀螺驱动模态和检测模态频差小于0.5Hz，大气压下品质因数约为500，在1Pa的低真空下达到14000。锁相放大器测试结果表明，在-200 ~200 o/s测量范围内，陀螺分辨力为0.05o/s，灵敏度为0.2uv/ o/s。测试结果表明该陀螺能够实现模态匹配和较高的品质因数，具有较高的性能指标。

High performance electromagnetic micro-machined ring vibration gyroscope

Mode matching and high quality factor (Q) are the keys to improve the performance of micro-machined vibrating ring gyroscope. In order to achieve high performance, a novel electromagnetic vibrating ring gyroscope was designed and fabricated, in which the centrosymmetric and enantiomorphous structure consisting of a ring and eight symmetric support springs was adopted to match the resonant frequencies of drive mode and sense mode. The theoretical models for the sensitivity and the mechanical noises of the gyroscope were deduced, moreover the effects of gyroscope parameters to the sensitivity and resolution were analyzed. Through the standard bulk MEMS processes, the gyroscope samples were fabricated with (100) silicon. All the processes are easy to achieve without bonding. Experiments show that the frequency split between the drive and sense modes is smaller than 0.5Hz, and the quality factor is about 500 in atmosphere and 14000 in vacuum with 1Pa. PLA (Phase Locked Amplifier) tests show that the resolution of the gyroscope is 0.05o/s and the sensitivity is 0.2uv/ o/s over a range of -200 ~200 o/s.