| 银粉的形状对低温固化导电银浆导电性能的影响 |
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| 引用本文： | 赵彬,殷有亮.银粉的形状对低温固化导电银浆导电性能的影响[J].印制电路信息,2013(9):27-29,63. |
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| 作者姓名： | 赵彬 殷有亮 |
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| 作者单位： | 科承贸易 上海有限公司,上海,200120 |
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| 摘 要： | 研究了银粉含量、形状、表面处理工艺对低温固化导电银浆导电性能的影响。结果显示，最理想的银粉质量含量在65%~70%之间。同时，鳞片状银粉和球形粉的混合体制成的浆料导电性能最佳。另外，最好的固化条件是150℃、2 h。
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| 关 键 词： | 银粉 低温固化 导电银浆 导电性能 |
Effect of silver powder on low temperature curing conductive silver paste |
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| ZHAO Bin
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YIN You-liang.Effect of silver powder on low temperature curing conductive silver paste[J].Printed Circuit Information,2013(9):27-29,63. |
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| Authors: | ZHAO Bin YIN You-liang |
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| Affiliation: | ZHAO Bin YIN You-liang |
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| Abstract: | In this paper, the effect of content, shape and surface treatment process of silver powder on low- temperature curing conductive paste was studied. It showed that mixture of flake and spherical silver powder was the better selection as filter. The best content of silver powder was 65%-70% and the best curing condition was 150℃ for 2 h. |
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| Keywords: | Silver Powder Low-Temperature Curing Conductive Silver Paste Electrical Conductivity |
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