Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum |
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Authors: | Tae Hyun Kim Young-Ho Kim |
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Affiliation: | (1) the Department of Materials Engineering at Hanyang University, Seoul, Korea |
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Abstract: | The interfacial reaction and intermetallic formation at the interface between tin solders containing a small amount of copper
with platinum were investigated in this study. Sn-0.7Cu and Sn-1.7Cu solders were reacted with platinum by dipping Pt/Ti/Si
specimens into the molten solder at 260°C. Sn-3.8Ag-0.7Cu solder was reacted with platinum by reflowing solder paste on a
Pt/Ti/Si substrate at 250°C. PtSn4 intermetallic formed in all specimens while Cu6Sn5 interfacial intermetallic was not observed at the solder/platinum interfaces in any specimens. A parabolic relationship existed
between the thickness of the Pt-Sn intermetallic and reaction time, which indicates the intermetallic formation in the solder/platinum
interface is diffusion controlled.
For more information, contact Young-Ho Kim, Hanyang University, Department of Materials Engineering, Seoul, 133-791, Korea;
e-mail kimyh@hanyang.ac.kr. |
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