| Cr/Cu/Ag/Cu/Cr新型银基复合薄膜电极的防氧化性能研究 |
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| 引用本文： | 翁卫祥,贾贞,于光龙,李昱,郭太良.Cr/Cu/Ag/Cu/Cr新型银基复合薄膜电极的防氧化性能研究[J].真空科学与技术学报,2011,31(4):381-385. |
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| 作者姓名： | 翁卫祥 贾贞 于光龙 李昱 郭太良 |
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| 作者单位： | 福州大学物理与信息工程学院 福州350002 |
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| 基金项目： | 福州大学博士基金(No.826768); 国家“863”计划重大专项(2008AA03A313); 福建省重大科技专项(2004HZ01-2) |
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| 摘 要： | 采用直流磁控溅射技术和光刻工艺制备了Cr/Cu/Ag/Cu/Cr复合薄膜及其电极,研究不同温度热处理对复合薄膜和电极结构、表面形貌和电性能的影响。Ag层与最外层的Cr层之间的Cu层不仅增强了Cr和Ag之间的粘附力,而且起到了牺牲层和氧气阻挡层的作用;Cr和Cu对Ag的双重保护使得薄膜电极在温度小于500℃时电阻率保持较为稳定,约为3.0×10-8~4.2×10-8Ω·m之间。然而由于电极表面氧化和边沿氧化的共同作用,薄膜电极的电阻率在热处理温度超过575℃出现了显著的上升。尽管如此,Cr/Cu/Ag/Cu/Cr薄膜电极仍然是一种能够承受高温热处理并且保持较低电阻率的新型电极,满足场发射平板显示器封接过程中的热处理要求。
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| 关 键 词： | Cr/Cu/Ag/Cu/Cr薄膜 薄膜电极 表面形貌 防氧化性能 |
Oxidation Resistance of Novel Ag-Based Cr/Cu/Ag/Cu/Cr Composite Film Electrodes |
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| Weng Weixiang,Jia Zhen,Yu Guanglong,Li Yu,Guo Tailiang.Oxidation Resistance of Novel Ag-Based Cr/Cu/Ag/Cu/Cr Composite Film Electrodes[J].JOurnal of Vacuum Science and Technology,2011,31(4):381-385. |
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| Authors: | Weng Weixiang Jia Zhen Yu Guanglong Li Yu Guo Tailiang |
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| Affiliation: | Weng Weixiang,Jia Zhen,Yu Guanglong,Li Yu,Guo Tailiang(College of Physics and Information Engineering,Fuzhou University,Fuzhou 350002,China) |
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| Abstract: | The novel type of electrode,fabricated with the Ag-based Cr/Cu/Ag/Cu/Cr composite layers deposited by DC magnetron sputtering and by lithography,was developed.The microstructures and properties of the composite layers,before and after annealing,were characterized with X-ray diffraction,scanning electron microscopy,and conventional surface probes.The impacts of the growth conditions on the composite layers were evaluated.We found that while acting as the oxygen diffusion barrier,the Cu layer improves the adh... |
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| Keywords: | Cr/Cu/Ag/Cu/Cr thin film Thin film electrode Microstructure Oxidation resistant |
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