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Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application |
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| Authors: | Yong Zhang Haoxue Han Nan Wang Pengtu Zhang Yifeng Fu Murali Murugesan Michael Edwards Kjell Jeppson Sebastian Volz Johan Liu |
| Affiliation: | 1. SMIT Center, School of Automation and Mechanical Engineering and Key State Laboratory of New Displays and System Applications, Shanghai University, Shanghai, China;2. BioNano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg, Sweden;3. CNRS, UPR 288 Laboratoire, d'énergétique Moléculaire et Macroscopique, Combustion (EM2C), Grande Voie des Vignes, Chatenay‐Malabry, France;4. école Centrale Paris, Grande Voie des Vignes, Chatenay‐Malabry, France;5. SHT Smart High Tech AB, Gothenburg, Sweden |
| Abstract: | It is demonstrated that a graphene‐based film (GBF) functionalized with silane molecules strongly enhances thermal performance. The resistance temperature detector results show that the inclusion of silane molecules doubles the heat spreading ability. Furthermore, molecular dynamics simulations show that the thermal conductivity (κ) of the GBF increased by 15%–56% with respect to the number density of molecules compared to that with the nonfunctionalized graphene substrate. This increase in κ is attributed to the enhanced in‐plane heat conduction of the GBF, resulting from the simultaneous increase of the thermal resistance between the GBF and the functionalized substrate limiting cross‐plane phonon scattering. Enhancement of the thermal performance by inserting silane‐functionalized molecules is important for the development of next‐generation electronic devices and proposed application of GBFs for thermal management. |
| Keywords: | graphene heat spreaders hotspots molecular dynamics phonon transport |
