CBGA、CCGA器件植球／柱工艺板级可靠性研究

陶瓷球栅阵列（CBGA）和陶瓷柱栅阵列（CCGA）封装由于其高密度、高可靠性和优良的电热性能，被广泛应用于武器装备和航空航天等电子产品。而CBGA／CCGA焊点由于其材料和结构特性，在温度循环等可靠性试验中焊点容易发生开裂，导致器件失效。本文以CBGA256和CCGA256封装产品为例，通过陶瓷基板与PCB板的菊花链设计来验证CBGA／CCGA焊点的可靠性，并对焊点的失效行为进行分析。结果表明，CCGA焊点可靠性要高于CBGA焊点，焊点主要发生蠕变变形，边角处焊点在温度循环过程中应力最大，容易最先开裂。

Board Level Reliability Issues in Ball ＆ Column Mount for CBGA/CCGA Devices

Ceramic ball grid array package and ceramic column grid array package pmducls have been fully ulilized into lhe military and aerospace fields due to ils high density, high reliabilily, and lhe excellenl elech%al and lhermal performance. Because of malerial and the special sh＇ucture, the failure of solder joinls could occur due In lhe crack propagation under cyclic thermal loading conditions. This paper look CB（,A256 and CCCA256 products as examples, the reliability of CBGA/CCGA solder.ioiu/s was verified by the daisy chain design of ceramic substrale and PCB, and the failure behavior of sohter joint was analyzed. The rest, hs showed that the solder joint reliability of CCGA was high- er than the sohter.joint reliability of CBGA. Creep behavior occurred in sohler joints. The comer solder joint was ear- liesl fractured, the reason is that ils stress is maximal.