无损监测技术在复合材料中的应用研究

本文利用JF2107B型自动介电分析仪对环氧/玻璃纤维复合材料的固化历程进行了研究。研究了升温速率、固化剂含量对复合材料介电性能的影响。结果表明,以1.25℃/min、2.5℃/min、5℃/min三种速率进行线性升温,随升温速率增加,tgδ曲线向左移动,损耗峰出现较早,表明固化反应提前了。环氧/玻璃纤维复合材料中,固化剂含量为65%时,tgδ与固化度分别为0.0538和98.5%。树脂固化终点的tgδ值与固化剂含量呈抛物线关系,有最小极值,最小极值点的配比为最佳配比,其C点tgδ值最低,固化度最高。

Study of Non-destructive Monitoring in Composites

The cure of the epoxy/fiber glass composites was researched by JF2107B auto dielectric system in this paper. The inflection of calefactive rate and the cure agent percent was studied with dielectric performance. The result indicates that the temperature rising in 1.25 ℃/min ,2.5 ℃/min,5 ℃/min, the curve of tgδ moved to the left along with increase of the calefactive rate. The peak of tgδ appears earher. In the epoxy/fiber glass composites, when the percent of the cure agent is 65 %, tgδ and cure percent is 0.0538 and 98.5% .The value of tgδ in the end point of resin cure appears parabola curve with the cure agent percent. There is a lowest point on the curve. The proportion of this point is the best proportion. The value of tgδ is lowest and the cure percent is highest. D