基于横电磁波小室的IC辐射发射测试方法研究

集成电路(IC)的发展呈现出小型化和集成化的趋势,使得IC电磁辐射越来越强,准确测试出IC电磁辐射对于集成电路电磁兼容设计有重要意义。横电磁波(TEM)小室法是目前最常用的IC辐射测试方法,它使用方形测试板,测试四个角度(0°, 90°, 270°, 360°)的IC辐射值,然而IC电磁辐射具有角度效应,仅用四个角度无法准确测试出IC最大电磁辐射水平。文中基于TEM小室全波仿真模型,使用单根微带线,验证了角度对于IC辐射的影响。设计了基于STM32芯片的圆形测试板和方形测试板,利用TEM小室测试了不同角度、不同模式下的STM32芯片电磁辐射,测量结果证实了不同模式下圆形测试板的测试结果都要大于方形测试板,最大偏差达到16 d Bm,因此圆形测试板更能准确测出芯片的最大电磁辐射水平。

Research on Radiated Emission Test Method of Integrated Circuit Based on Transverse Electromagnetic Wave Cell

The development of integrated circuit (IC) shows the trend of miniaturization and integration, which makes the IC electromagnetic radiation more and more strong. It is of great significance to accurately test the IC electromagnetic radiation for the EMC design of integrated circuit. The transverse electromagnetic wave (TEM) chamber method is the most common IC radiation test method at present. This method uses a square test plate to test the IC radiation value at four angles (0°, 90°, 270°, 360°). Due to the angle effect of IC electromagnetic radiation, the IC electromagnetic radiation level can not be tested only by four angles. In this paper, the effect of angle on IC radiation is verified by using a single microstrip line based on TEM cell full-wave simulation model. The paper designs a round test board and a square test board based on the STM32 chip. TEM chamber is used to test the electromagnetic radiation of the STM32 chip at different angles and in different modes. The measurement results confirms that the test results of the round test board are greater than those of the square test board in different modes, and the maximum deviation reaches 16 dBm. Therefore, the round test plate can more accurately measure the electromagnetic radiation level of the chip.