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不同络合剂对化学镀镍过程的影响
引用本文:张道礼,龚树萍,周东祥.不同络合剂对化学镀镍过程的影响[J].材料开发与应用,2000,15(1):5-8.
作者姓名:张道礼  龚树萍  周东祥
作者单位:华中理工大学电子科学与技术系,武汉,430074
基金项目:国家“863”计划资助!项目( 合同号715006070)
摘    要:用热力学平衡的方法研究了在BaTiO3 系陶瓷PTCR 上进行化学沉积金属镍电极时常用的醋酸盐 镍离子、甘氨酸 镍离子和柠檬酸盐 镍离子体系化学镀镍溶液中各种型体镍离子的分布。研究结果表明,加入络合剂会影响化学镀镍的速度,醋酸盐会使化学沉积速度升高,而甘氨酸和柠檬酸盐会使化学镀镍速度明显下降,这可能和混合电位及空间位阻、化学键合力等因素有关。选择合适的络合剂对于化学镀镍的稳定操作有着十分重要的意义。

关 键 词:化学镀镍  离子型体分布  络合剂  作用
修稿时间:1999-04-02

The Effect of Complexing Agents on the Processing of Electroless Nickel Plating
Zhang Daoli,Gong Shuping,Zhou Dongxiang.The Effect of Complexing Agents on the Processing of Electroless Nickel Plating[J].Development and Application of Materials,2000,15(1):5-8.
Authors:Zhang Daoli  Gong Shuping  Zhou Dongxiang
Abstract:Based on thermodynamic speciation calculations, the roles of complexing agents in electroless nickel solutions, employed in ohemic electrodes formation of BaTiO 3 based PTCR ceramics, were investigated in this paper. Electroless nickel solutions, using acetate or citrate or glycine, decrease the concentration of free nickel. All solutions exhibit a fraction of free nickel, which would be decreased with the formation constant of the nickel ligand species increased. The plating rate and solution stability are dependent upon the structure of nickel in solution. Higher deposition rates were observed in nickel solutions with fewer chelated sites in the nickel complex.
Keywords:Electroless nickel plating  Speciation of nickel ion  Complexing agents  Effect
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