Morphological evolution of edge-hillocks on single-crystal films having anisotropic drift-diffusion under the capillary and electromigration forces |
| |
Authors: | Tarik Omer Ogurtani Aytac Celik |
| |
Affiliation: | Department of Metallurgical and Materials Engineering, Middle East Technical University, 06531, Ankara, Turkey |
| |
Abstract: | The morphological evolution of hillocks at the unpassivated sidewalls of single-crystal metallic thin film interconnects is investigated via computer simulations using the free-moving boundary value problem. The effect of drift-diffusion anisotropy on the development of surface topographical scenarios is fully explored under the action of electromigration and capillary forces, utilizing numerous combinations of the surface texture, the drift-diffusion anisotropy and the direction of the applied electric field. The simulation studies yield analytical relationships for the velocity of the surface solitary waves and the drift velocity of electromigration-induced internal voids as a function of the applied current densities, which contain intrinsic and structural properties of the single-crystal thin films. The threshold value of the applied current density, above which electromigration-induced internal voids can be formed and may cause the catastrophic failure of interconnects by breaching, also appears explicitly in this relationship. |
| |
Keywords: | 85 40 Ls 66 30 Qa 68 35 Md 05 70 Np 82 20 Wt 07 05 Tp |
本文献已被 ScienceDirect 等数据库收录! |
|