| 液冷模块的热仿真分析 |
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| 引用本文： | 赵亮,杨明明,张娅妮,郭建平,白振岳.液冷模块的热仿真分析[J].航空计算技术,2012(1):132-134. |
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| 作者姓名： | 赵亮 杨明明 张娅妮 郭建平 白振岳 |
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| 作者单位： | 中航工业西安航空计算技术研究所,陕西西安710068 |
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| 基金项目： | 武器装备预研基金项目资助（9140A160608HK61） |
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| 摘 要： | 运用基于CFD的热仿真软件Flotherm对液冷模块进行了热仿真分析,分别研究了在不同环境温度,不同冷却液流量以及不同冷却液温度条件下,液冷模块内部温度场的变化规律。仿真分析结果表明,环境温度对液冷模块的温度场影响非常小;液冷模块冷却液流量的增幅与元器件温度的降幅并非正比关系;元器件温度的升幅与冷却液温度的增幅相同。
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| 关 键 词： | 液冷模块 热分析 温度场 元器件 |
Thermal Simulation of Some Liquid Cooling Module |
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| ZHAO Liang,YANG Ming-ming,ZHANG Ya-ni,GUO Jian-ping,BAI Zhen-yue.Thermal Simulation of Some Liquid Cooling Module[J].Aeronautical Computer Technique,2012(1):132-134. |
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| Authors: | ZHAO Liang YANG Ming-ming ZHANG Ya-ni GUO Jian-ping BAI Zhen-yue |
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| Affiliation: | (Xi′an Aeronautics Computing Technique Research Institute,AVIC,Xi′an 710068,China) |
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| Abstract: | Some Liquid Cooling Module was analysed by CFD Software Flotherm.The temperature variation of the module under different ambient temperature,coolant flow and coolant inlet temperature was studied.The results showed that the influence of the ambient temperature is very small,the increasing of the coolant flow and the reduction of the chip temperature is not a direct proportion relation and the temperature rise of the chip is the same as the coolant inlet temperature rise. |
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| Keywords: | liquid cooling module thermal analysis temperature field chip |
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