| Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能 |
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| 引用本文： | 徐佳琛,薛松柏,薛鹏,杨洁.Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能[J].焊接学报,2015,36(1):83-86. |
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| 作者姓名： | 徐佳琛 薛松柏 薛鹏 杨洁 |
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| 作者单位： | 1.南京航空航天大学材料科学与技术学院, 南京 210016 |
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| 基金项目： | 江苏省普通高校研究生科研创新计划资助项目(CXZZ12_0148);新型钎焊材料与技术国家重点实验室开放课题资助项目(郑州机械研究所)SKLABFMT201102 |
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| 摘 要： | 研究了稀土元素Nd的添加量对超低银无铅钎料Sn-0.3Ag-0.7Cu的润湿性能、显微组织和力学性能的影响.结果表明,微量Nd元素的加入可以显著改善Sn-0.3Ag-0.7Cu超低银无铅钎料的润湿性能和焊点的力学性能,并且能够起到细化基体组织的作用.当钎料中Nd元素的质量分数达到0.1%时,钎料的综合性能最佳,基体组织最为均匀细化.虽然Ag元素含量的降低使钎料的性能有所下降,但是加入适量Nd元素后钎料的润湿性能已接近传统Sn-3.8Ag-0.7Cu钎料.
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| 关 键 词： | 无铅钎料 润湿性能 力学性能 Nd元素 显微组织 |
| 收稿时间： | 2014/10/9 0:00:00 |
Effect of Nd on properties and microstructure of Sn-0.3Ag-0.7Cu-xNd lead-free solder |
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| XU Jiachen,XUE Songbai,XUE Peng and YANG Jie.Effect of Nd on properties and microstructure of Sn-0.3Ag-0.7Cu-xNd lead-free solder[J].Transactions of The China Welding Institution,2015,36(1):83-86. |
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| Authors: | XU Jiachen XUE Songbai XUE Peng and YANG Jie |
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| Affiliation: | 1.College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China2.College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;College of Mechanical & Electrical Engineering, Nanjing College of Information Technology, Nanjing 210016, China |
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| Abstract: | The effect of Nd on the wettability, microstructure and mechanical properties of Sn-0.3Ag-0.7Cu solder was investigated. The results indicated that the wettability of Sn-0.3Ag-0.7Cu was significantly improved with the addition of Nd and the microstructure of Sn-0.3Ag-0.7Cu was refined. When the amount of Nd reached to 0.1%, the wettability and mechanical properties of the solder were optimal. In addition, the wettability of Sn-0.3Ag-0.7Cu-0.1Nd approaching to Sn-3.8Ag-0.7Cu solder although the wettability of Sn-0.3Ag-0.7Cu solder is poorer due to the decrease of Ag adding. |
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| Keywords: | lead-free solders wettability mechanical properties Nd microstructure |
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