Si含量对Al-Si电子封装材料组织和性能的影响

采用热压成形工艺制备了Al-50Si、Al-60Si、Al-70Si合金电子封装材料,研究Si含量对材料组织和性能的影响。结果表明,Si含量对Al-xSi高Si铝合金有很大影响,Si含量为50%时,Al基体形成连续网络结构,但存在大量细小的孔隙。当Si含量增加到60%,Al基体呈连续网络状分布,内部孔洞减少。当Si含量达到70%,Si颗粒相互依存长大的几率更大,Si相尺寸明显长大。Al-60Si合金性能最佳,热导率为128.0W/(m·K),室温到150℃合金的热膨胀系数为9.92×10^-6℃^-1,密度为2.462g/cm^3。

Effects of Si Content on Microstructure and Properties of Al-Si Electronic Packaging Materials

The composites of Al-50 Si,Al-60 Si and Al-70 Si alloy were prepared by hot pressing to understand effect of Si content on the microstructure and physical properties of the composites prepared.The results show that the Si content has a great influence on powder metallurgy aluminum-silicon composites.When the Si content is 50%,the Al matrix forms a continuous network structure in the composites prepared,however a large number of fine pores can be observed.When the Si content is increased to 60%,the Al matrix is distributed in a continuous network and the internal pores are reduced obviously.When the Si content reaches 70%,the probability of Si particles growing apart from each other presents more obvious,and the Si phase size is significantly increased.The Al-60 Si composites has the desirable performance with thermal conductivity of 128.0 W/(m·K),and the thermal expansion coefficient is 9.92×10^-6℃^-1 from room temperature to 150℃,and the density reaches up to2.462 g/cm^3.