| “绑定中测试”“多绑一测”方式对于测试过程的影响 |
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| 引用本文： | 秦振陆,方芳,王伟,朱侠,郭二辉,任福继.“绑定中测试”“多绑一测”方式对于测试过程的影响[J].计算机工程与科学,2016,38(8):1602-1608. |
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| 作者姓名： | 秦振陆 方芳 王伟 朱侠 郭二辉 任福继 |
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| 作者单位： | ;1.合肥工业大学计算机与信息学院;2.合肥工业大学情感计算与先进智能机器安徽省重点实验室;3.中国电子科技集团第三十八研究所 |
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| 基金项目： | 国家自然科学基金重点项目(61432004);国家自然科学基金(61474035,61204046,61306049 );安徽省科技攻关项目(1206c0805039);安徽省自然科学基金(1508085QF129);教育部新教师基金(20130111120030) |
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| 摘 要： | 随着半导体工艺水平的不断发展,3D芯片技术已成为一大研究热点。"绑定中测试"环节的提出对于芯片的测试流程有了新的要求。但是,"绑定中测试""一绑一测"的特点会使部分裸片被重复测试,从而带来测试时间的增加。从"绑定中测试"的过程出发,协同考虑测试功耗与"理论制造成本"对于"绑定中测试"的影响,提出"多绑一测"的测试流程。在此基础上提出相应的广度优先遍历算法,结合ITC’02电路的相关参数,体现本文思想在实际生产制造中的现实意义。
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| 关 键 词： | 绑定中测试 多绑一测 功耗约束 “理论制造成本”约束 |
| 收稿时间： | 2016-04-15 |
| 修稿时间： | 2016-08-25 |
Impact of “one testing after multiple bondings” on the testing process in “mid-bond tests” |
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| QIN Zhen-lu,FANG Fang,WANG Wei,ZHU Xia,GUO Er-hui,REN Fu-ji.Impact of “one testing after multiple bondings” on the testing process in “mid-bond tests”[J].Computer Engineering & Science,2016,38(8):1602-1608. |
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| Authors: | QIN Zhen-lu FANG Fang WANG Wei ZHU Xia GUO Er-hui REN Fu-ji |
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| Affiliation: | （1.School of Computer and Information,HeFei University of Technology,Hefei 230009;
2.Anhui Province Key Laboratory of Affective Computing and Advanced
Intelligent Machine,Hefei University of Technology,Hefei 230009;
3.The 38th Research Institute,China Electronics Technology Group Corporation,Hefei 230009,China） |
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| Abstract: | With the continuous development of semiconductor technology, 3D chip technology has become a hot research highlight, and the process of chip testing has a new requirement for “mid-bond tests”. But for the “mid-bond test”, “one testing after every bonding” makes some dies repeat testing, thus resulting in an increase of test time. We put forward a "one testing after multiple bondings" testing process which considers the effect of test power consumption and "theoretical manufacturing cost". Besides, we also introduce a breadth first traversal algorithm, which combines the relevant parameters of ITC'02 circuit. The combination reflects our proposal's practical significance in actual production. |
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| Keywords: | mid-bond test one testing after multiple bondings power constrains theoretical manufacturing cost constrains |
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