Molecular dynamics simulation on elastoplastic properties of the void expansion in nanocrystalline copper |
| |
| Authors: | Yong Yang Ying Li Guowei Zhang Zailin Yang Jin Liu Hairui Li Jianwei Zhao |
| |
| Affiliation: | 1.College of Aerospace and Civil Engineering,Harbin Engineering University,Harbin,China;2.Key Laboratory of Advanced Material of Ship and Mechanics, Ministry of Industry and Information Technology,Harbin Engineering University,Harbin,China;3.College of Materials and Textile Engineering,Jiaxing University,Jiaxing,China |
| |
| Abstract: | Influences of different factors on the elastic-plastic properties of nanocrystalline copper containing a void are studied by the molecular dynamics method. The radius of the circular plate is 30a, while the radius of the void is 5a (a is 0.3615 nm for the lattice constant of bulk copper). The effects of crystal orientation, the void ellipticity, loading rate, and temperature of nanocrystalline copper are discussed. The elastic-plastic deformation of nanocrystalline under inner pressure is investigated in this research. The plastic zone is determined according to the dislocation nucleation from the edge of the void. The simulation results show that there are different deformation mechanisms under different crystal orientations, and the nanocrystalline copper can be strengthened by changing the void shape, decreasing the loading rate, and lowering the temperature. And the plastic zone initiation and growth are further explained. The change of different conditions has a great influence on plastic zone. |
| |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ |
|
