Microelectronic chip cooling: an experimental assessment of a liquid-passing heat sink,a microchannel heat rejection module,and a microchannel-based recirculating-liquid cooling system |
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Authors: | Bin Lu W J Meng Fanghua Mei |
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Affiliation: | (1) Department of Mechanical Engineering, Louisiana State University, Baton Rouge, LA 70803, USA;(2) Enervana Technologies LLC, Baton Rouge, LA 70820, USA; |
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Abstract: | Results of heat transfer testing of heat absorption modules (HAM), heat rejection modules (HRM), and a recirculating-liquid
cooling system are reported. Low-profile, Cu-based, microchannel heat exchangers (MHEs) were fabricated and used as the HAM
as well as components for assembly of a microchannel HRM. Detailed experimental assessment of two different liquid-passing
HRMs and a microchannel-based recirculating-liquid cooling system was carried out, and benchmarked against all-solid devices
of the same geometric dimensions. Incorporating microchannel liquid flow through each fin, the device-level heat transfer
performance of the microchannel HRM was improved by up to ~50%. Detailed testing of a microchannel-based recirculating-liquid
cooling system indicate that low-profile Cu MHEs are highly effective in heat flux removal while having a small area/volume
footprint, and that enhancing the HRM performance is critical to boosting the overall performance of such recirculating-liquid
cooling systems. |
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