| SMT用焊锡粉生产技术现状及发展趋势分析 |
| |
| 引用本文： | 普友福,朱华明,武信.SMT用焊锡粉生产技术现状及发展趋势分析[J].云南冶金,2012,41(3):47-51. |
| |
| 作者姓名： | 普友福 朱华明 武信 |
| |
| 作者单位： | 云锡研究设计院,云南个旧,661000 |
| |
| 摘 要： | 对焊锡粉生产的雾化技术和分级技术现状进行了对比研究,以及对近几年焊锡粉产品发展进行分析,通过研究分析,得出焊锡粉雾化技术和分级技术发展方向,并预期未来焊锡粉生产技术的发展趋势。
|
| 关 键 词： | 焊锡粉 气流雾化 离心雾化 超声雾化 分级技术 |
Analysis on Status Quo of Production Technologies of Solder Powder for Surface Mounting Technology (SMT) and Their Development Trend |
| |
| PU You-fu
,
ZHU Hua-ming
,
WU Xin.Analysis on Status Quo of Production Technologies of Solder Powder for Surface Mounting Technology (SMT) and Their Development Trend[J].Yunnan Metallurgy,2012,41(3):47-51. |
| |
| Authors: | PU You-fu ZHU Hua-ming WU Xin |
| |
| Affiliation: | (The Design and Research Institute of Yunnan Tin Group, Gejiu, Yunnan 661000, China) |
| |
| Abstract: | The contrast study on the atomization technology and classification technology for solder powder was conducted. By analyzing and studying the development of solder powder products in the last few years, the development direction of the atomization technolo- gy and classification technology for solder powder has been obtained. And then, the developing tendency of production technology of solder powder was predicted. |
| |
| Keywords: | Solder powder airflow atomization centrifugal atomization ultrasonic atomization classification technology |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
