| 电子封装模具设计研究现状及进展 |
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| 引用本文： | 杨良波,周起雄,钱心远,刘方辉,高雪芹,张杰.电子封装模具设计研究现状及进展[J].塑料科技,2009,37(10). |
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| 作者姓名： | 杨良波 周起雄 钱心远 刘方辉 高雪芹 张杰 |
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| 作者单位： | 四川大学高分子科学与工程学院高分子材料工程国家重点实验室,四川,成都,610065 |
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| 基金项目： | 国家自然科学基金，国家基础研究专项经费，国家重点实验室专项经费联合资助 |
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| 摘 要： | 介绍了塑料封装模具在集成电路、半导体、芯片等电子产品中的应用,重点讨论了塑料封装模具的分类、组成和设计要点,比较了注塑模具和塑料封装模具的区别,展望了塑料封装模具的发展方向。
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| 关 键 词： | 塑料封装模具 电子产品 研究进展 |
Research Actuality and Advance of Design of Plastic Package Mould for Electronics |
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| Yang Liangbo,Zhou Qixiong,Qian Xinyuan,Liu Fanghui,Gao Xueqin,Zhang Jie.Research Actuality and Advance of Design of Plastic Package Mould for Electronics[J].Plastics Science and Technology,2009,37(10). |
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| Authors: | Yang Liangbo Zhou Qixiong Qian Xinyuan Liu Fanghui Gao Xueqin Zhang Jie |
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| Abstract: | The application of plastic package mould in the electronic products,such as integrated circuit,semiconductor,chip,and etc.,was introduced. The classification,composition and key design points of plastic package mould were discussed in detail. The difference between commom injection mould and plastic package mould was compared. The development direction of the plastic package mould was predicted. |
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| Keywords: | Plastic package mould Electronic product Research progress |
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