Institute of Semiconductor Physics Frankfurt (Oder) GmbH, Walter-Korsing-Str. 2, 15230, Frankfurt (Oder, FRG
Abstract:
This article describes the fabrication of single crystal silicon field emission tip arrays. Each array consists of 2500 tips. We used 4 in. (100) oriented n type silicon wafers 0.008 – 0.020 Ωcm, Sb doped. The tips were formed using a RIE process. We achieved crystalline emitter tip radiuses of 1.5 – 2 nm. The extraction grid is a self aligned, sputter deposited Ti0.1W0.9 film. The radiuses of the extraction grid apertures range from 300 to 150 nm and have a tip to tip spacing from 10 to 5 μm. The testing was done in vacuum with a distance of 500 μm between extraction grid and anode. We have seen maximum stable array currents up to 2 μA. An anode current of 10 nA was initially detected at a minimal gate bias of about 14 V.