| 一种提高微电路外壳使用可靠性的方法 |
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| 引用本文： | 秦国林,白景成.一种提高微电路外壳使用可靠性的方法[J].微电子学,1996,26(1):43-46. |
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| 作者姓名： | 秦国林 白景成 |
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| 作者单位： | 电子工业部第２４研究所 |
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| 摘 要： | 简要分析了白瓷双列直插外壳的失效模式和失效机理，并进行了模拟实验，通过对实验结果的分析，提出对成品微电路进行二次电镀能够提高其外壳的使用可靠性。
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| 关 键 词： | 集成电路 双列直插外壳 可靠性 |
A Technique to Improve the Reliability of Microcircuit Packages |
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| QIN Guolin and BAI Jingcheng.A Technique to Improve the Reliability of Microcircuit Packages[J].Microelectronics,1996,26(1):43-46. |
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| Authors: | QIN Guolin and BAI Jingcheng |
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| Abstract: | The failure mode and failure mechanism for white ceramic DIP's are analyzed,and experimental simulation is performed. It has been shown that the reliability of microcireuit packages can be improved by secondary electroplating. |
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| Keywords: | Integrated circuit Dual-in-line-package Reliability |
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