| 化学镀Ni-Cu-P合金工艺研究 |
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| 引用本文： | 叶栩青,罗守福,王永瑞.化学镀Ni-Cu-P合金工艺研究[J].腐蚀与防护,2000,21(3):126-128,139. |
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| 作者姓名： | 叶栩青 罗守福 王永瑞 |
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| 作者单位： | 上海交通大学,上海,200030 |
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| 摘 要： | 通过实验数据及图表论述了化学镀 Ni- Cu- P的工艺条件 ,探讨了镀液的主要组成成分、镀液的 p H值、施镀时间对镀层中 Ni、Cu、P质量百分含量、镀层的沉积速度的影响 ,总结随工艺参数变化镀层成分变化的趋势及规律
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| 关 键 词： | 化学镀 镀层 成分 工艺 电镀 镀合金 镍铜磷合金 |
STUDY OF TECHNOLOGY OF ELECTROLESS PLATING OF Ni-Cu-P ALLOY |
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| Ye Xuqing,Luo Shoufu,Wang Yongrui.STUDY OF TECHNOLOGY OF ELECTROLESS PLATING OF Ni-Cu-P ALLOY[J].Corrosion & Protection,2000,21(3):126-128,139. |
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| Authors: | Ye Xuqing Luo Shoufu Wang Yongrui |
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| Abstract: | Technology of electroless plating of Ni Cu P alloy was investigated through a great deal of experiments. Influence of components and pH of the bath and plating time on the percentage content of Ni Cu P in the coating and the deposition rate of the alloy were discussed and tendency of coating components with changing technology paraments was summarised. |
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| Keywords: | Elestroless plating Ni Cu P alloy Coating component |
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