首页 | 官方网站   微博 | 高级检索  
     

钢颗粒增强铜基复合材料的界面和传导性
引用本文:朱玉龙,翟启杰,黄卫华,肖劲,刘学琴. 钢颗粒增强铜基复合材料的界面和传导性[J]. 特种铸造及有色合金, 2000, 0(1): 7-9
作者姓名:朱玉龙  翟启杰  黄卫华  肖劲  刘学琴
作者单位:北京科技大学
摘    要:采用悬浮浇铸工艺并控制冷却速度成功地得到了钢颗粒增强纯铜基铸造复合材料。研究表明,钢颗粒与纯铜基体结合良好,钢颗粒没有固溶于纯铜基体,没有造成铁污染,也没有过度扩散,其电阻率为2.132×10

关 键 词:界面 传导性 钢颗粒 铜基 复合材料 悬浮浇铸
文章编号:1001-2249(2000)01-0007-03
修稿时间:1999-09-22

Interface and Conductivity of Pure Copper Matrix Cast Composite Reinforced by Steel Grain
Zhu Yulong,Zhai Qijie,Huang Weihua,Xiao Jin,Liu Xueqin. Interface and Conductivity of Pure Copper Matrix Cast Composite Reinforced by Steel Grain[J]. Special Casting & Nonferrous Alloys, 2000, 0(1): 7-9
Authors:Zhu Yulong  Zhai Qijie  Huang Weihua  Xiao Jin  Liu Xueqin
Affiliation:Beijing University of Science and Technology
Abstract:Steel grain-reinforced pure copper cast composite was gotten successfully by suspension casting process and controlling the cooling rate. The results showed that interface grain and pure copper matrix combined well,and the steel grain did not dissolve into copper matrix. There were no pollution of iron element and over diffusion after adding steel grain and the conductivity was as high as 81 %IACS.
Keywords:Interface  Conductivity  Steel Grain  Coppr Matrix Composite   Suspension Casting
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司    京ICP备09084417号-23

京公网安备 11010802026262号