| 超导芯片铟焊质量试验研究 |
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| 引用本文： | 丁晓杰,李玲,王丽,王曦雯.超导芯片铟焊质量试验研究[J].低温与超导,2012,40(3):31-35. |
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| 作者姓名： | 丁晓杰 李玲 王丽 王曦雯 |
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| 作者单位： | 中国电子科技集团公司第16研究所,合肥,230043 |
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| 基金项目： | 中国电子科技集团公司科技部预研基金(62401110303) |
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| 摘 要： | 为考察超导芯片接地钎焊质量,参照电子元器件试验方法相关国家标准,模拟超导器件工作温度和真空环境制作了试验装置,对钎焊后的超导芯片样品进行了温度冲击试验、完整超导器件系列环境试验,并对试验数据和结果进行了分析。
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| 关 键 词： | 钎焊 温度循环 剪切试验 |
Reliability of indium- soldering applied on superconducting chip |
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| Ding Xiaojie
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Li Ling
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Wang Li
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Wang Xiwen.Reliability of indium- soldering applied on superconducting chip[J].Cryogenics and Superconductivity,2012,40(3):31-35. |
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| Authors: | Ding Xiaojie Li Ling Wang Li Wang Xiwen |
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| Affiliation: | (The 16th Institute of CETC,Hefei 230043,China) |
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| Abstract: | For investigating the quality of superconducting device ground soldering,the author refered to relative national standards of test methods for electronic components,set up the test apparatus which through simulating superconducting device practical working temperature and vacuum condition.Then some soldered superconducting chip samples were put to heat shock test,furthermore,a practical superconducting transmission line also underwent series tests,and the test data and results has been analyzed at length. |
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| Keywords: | Soldering Thermal cycling Shearing test |
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