| 高密度互连印制板电镀填盲孔技术 |
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| 引用本文： | 陈世金,罗旭,覃新,韩志伟,徐缓.高密度互连印制板电镀填盲孔技术[J].印制电路信息,2013(7):41-48. |
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| 作者姓名： | 陈世金 罗旭 覃新 韩志伟 徐缓 |
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| 作者单位： | 博敏电子股份有限公司,广东 梅州,514768 |
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| 摘 要： | 主要介绍了电镀填盲孔的过程机理和影响填孔效果的因素,重点探讨了电镀设备、电镀参数、添加剂等对电镀填孔效果的影响,突出讲解了电镀填盲孔技术的控制重点和难点等内容。
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| 关 键 词： | 印制电路板 电镀填孔 添加剂 阳极 填充率 |
Research on blind via filling plating technology for HDI in PCB manufacturing |
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| CHEN Shi-jin
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LUO Xu
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QIN Xin
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HAN Zhi-wei
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XU Huan.Research on blind via filling plating technology for HDI in PCB manufacturing[J].Printed Circuit Information,2013(7):41-48. |
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| Authors: | CHEN Shi-jin LUO Xu QIN Xin HAN Zhi-wei XU Huan |
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| Affiliation: | CHEN Shi-jin, LUO Xu ,QIN Xin, HAN Zhi-wei, XU Huan |
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| Abstract: | In this article,the mechanism of blind via filling plating,the effecting factors to copper filling result were introduced,such as plating equipment,parameters,additive effect to the via filling plating.The main control process and the difficulties points of the blind via filling plating were specially illustrated. |
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| Keywords: | Printed Circuit Board Via Filling Plating Additive Anode Filling Power |
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