MF(I)S结构设计对硅基铁电薄膜系统C-V特性的影响

为制备符合铁电场效应晶体管（ Ｆ Ｆ Ｅ Ｔ） 及铁电存储二极管（ Ｆ Ｍ Ｄ） 要求的高质量铁电薄膜，采用 Ｐ Ｌ Ｄ （ Ｐｕｌｓｅｄ Ｌａｓｅｒ Ｄｅｐｏｓｉｔｉｏｎ） 工艺， 制备了不同 Ｍ Ｆ （ Ｉ） Ｓ 结构的硅基铁电薄膜系统由 Ｃ－ Ｖ特性的对比分析可见， 影响 Ｃ－ Ｖ 特性的主要因素除了衬底类型、界面特性之外， 还有薄膜的结构设计在此基础上， 为改善铁电薄膜的 Ｃ－ Ｖ 特性提出了合理设想.

C-V Characteristics of Ferroelectric Thin Film Systems with MF(I)S Structures on Si

In order to fabricate high quality ferroelectric thin films qualified for Ferroelectric Field Effect Transistors (FFETs) and Ferroelectric Memory Diodes (FMDs), different ferroelectric thin film systems, with the structure of MF (I) S, were deposited by using the pulsed laser deposition technique. The C-V characteristics of them were analyzed with comparison. The results showed that the primary factors having effect on C-V characteristics included configuration designs of the thin films in addition to the substrate type and the interface properties of the systems. Based on the above results, practicable thoughts to improve the C-V characteristics of ferroelectric thin films were presented.