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一种新颖的MEMS表面工艺牺牲层厚度的电测量方法
引用本文:李晓鹏, 李伟华,.一种新颖的MEMS表面工艺牺牲层厚度的电测量方法[J].电子器件,2006,29(1):73-75.
作者姓名:李晓鹏  李伟华  
作者单位:东南大学MEMS教育部重点实验室,南京,210096;东南大学MEMS教育部重点实验室,南京,210096
基金项目:国家重点基础研究发展计划(973计划)
摘    要:牺牲层厚度是MEMS表面工艺中的一个重要参数,对它的测量和控制有着重要的意义。目前大多采用光机械的方法来测量,但是测试方法复杂、测试时间长。本文介绍了一种新颖的MEMS表面工艺牺牲层厚度测试技术,实现了牺牲层厚度的电测量。测试方法简单快捷,并且很便于测试系统集成。

关 键 词:牺牲层  厚度  电测量
文章编号:1005-9490(2006)01-0073-03
收稿时间:2005-04-28
修稿时间:2005-04-28

A Novel Method for Electronical Measurement of the Sacrificial Layer Thickness
LI Xiao-peng,LI Wei-hua.A Novel Method for Electronical Measurement of the Sacrificial Layer Thickness[J].Journal of Electron Devices,2006,29(1):73-75.
Authors:LI Xiao-peng  LI Wei-hua
Affiliation:The key laboratory of MEMS of The Education Ministry , Southeast University ,Nanjing 210096, China
Abstract:Sacrificial layer thickness is one of the significant parameters of MEMS surface process and its measurement and control is very important. At present, most measurements are through optomechanical method, but these methods are too complex and need too much measuring time. A novel electronical measurement method for the sacrificial layer thickness measurement of MEMS surface process is presented. This method is simple and rapid, and be used easily as a part of MEMS measurement system.
Keywords:sacrificial layer  thickness  electronieal measurement
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