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填充型导热橡胶研究开发现状
引用本文:杜茂平,魏伯荣,闫刚,杨海涛,肖琰.填充型导热橡胶研究开发现状[J].合成橡胶工业,2007,30(1):73-77.
作者姓名:杜茂平  魏伯荣  闫刚  杨海涛  肖琰
作者单位:西北工业大学,高分子研究所,陕西,西安,710072
摘    要:综述了填充型导热橡胶的典型理论模型和导热机理,介绍了单组分导热填料填充体系和多组分导热填料填充体系的国内外研究开发状况,指出了今后导热橡胶的开发方向。

关 键 词:导热橡胶  导热理论模型  导热机理  导热填料  热导率
文章编号:1000-1255(2007)01-0073-05
修稿时间:2005年12月19

Research and development status of filled thermal conductive rubber
Du Maoping,Wei Borong,Yan Gang,Yang Haitao,Xiao Yan.Research and development status of filled thermal conductive rubber[J].China Synthetic Rubber Industry,2007,30(1):73-77.
Authors:Du Maoping  Wei Borong  Yan Gang  Yang Haitao  Xiao Yan
Abstract:Typical theory model and thermal conducting mechanism of filled thermal conductive rubber were summarized,and the research and development status of thermal conductive systems filled with single filler and multi-fillers in the world were reviewed with 29 references,and developing prospects for thermal conductive rubber were also pointed out.
Keywords:thermal conductive rubber  thermal conducting theory model  thermal conducting mechanism  thermal conducting filler  thermal conductivity
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