Synthesis and DSC study on Sn3.5Ag alloy nanoparticles used for lower melting temperature solder |
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Authors: | Changdong Zou Yulai Gao Bin Yang Qijie Zhai |
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Affiliation: | (1) Shanghai Key Laboratory of Modern Metallurgy & Materials Processing, Shanghai University, Yanchang Road 149, Shanghai, 200072, People’s Republic of China; |
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Abstract: | The traditional Sn–Pb eutectic solder alloys are being phased out from the electronics industry due to the toxicity of lead
(Pb), leading to the development and implementation of lead-free solders. Sn3.5Ag lead-free solder alloy, considered to be
one of the promising alternatives to replace the traditionally used Sn–Pb solder, however, still has some weaknesses, such
as its higher melting temperature than that of the Sn–Pb solder alloy. A possible way to decrease the melting temperature
of a solder alloy is to decrease the alloy particle size to the nanometer range. Sn3.5Ag nanoparticles with different size
distribution were synthesized using chemical reduction method by applying NaBH4 as reduction agent. The melting properties of these synthesized nanoparticles were studied by differential scanning calorimetry
(DSC), and size-dependent melting temperature depression of these nanoparticles has been observed. Gibbs–Thomson equation
was used to analyze the size-dependent melting temperature property, giving a good prediction of the melting temperature depression
for the Sn-based lead-free solder alloy nanoparticles. |
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