| 密封胶粘剂在高可靠微电子封装中的应用 |
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| 引用本文： | 孙瑞花,邵崇俭.密封胶粘剂在高可靠微电子封装中的应用[J].半导体技术,2007,32(5):440-442. |
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| 作者姓名： | 孙瑞花 邵崇俭 |
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| 作者单位： | 中国电子科技集团公司,第十三研究所,石家庄,050051 |
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| 摘 要： | 阐述了高可靠微电子封装对密封胶粘剂的性能要求.通过试验优选出一种能实现高可靠、高气密粘接封帽的环氧树脂胶粘剂,用该胶粘剂封帽的外壳通过了严苛的可靠性考核.详细介绍了胶粘封帽工艺过程,并对影响封帽质量及可靠性的因素进行了探讨.
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| 关 键 词： | 胶粘剂 气密性 可靠性 封帽工艺 |
| 文章编号： | 1003-353X(2007)05-440-03 |
| 修稿时间： | 2006-11-17 |
Application of Adhesives in High Reliability Microelectronic Packages |
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| SUN Rui-hua,SHAO Chong-jian.Application of Adhesives in High Reliability Microelectronic Packages[J].Semiconductor Technology,2007,32(5):440-442. |
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| Authors: | SUN Rui-hua SHAO Chong-jian |
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| Affiliation: | The 13^th Research Institute, CETC, Shijiazhuang 050051, China |
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| Abstract: | The requirements of high reliability microelectronic packages on adhesive performance were expounded.An epoxy resin realizing high hermetic lid sealing with high reliability was optimized.The packages sealed with this adhesive passed very strict reliability test.The processes of adhesive lid sealing was described,and the factors which affecting the quality of lid sealing and reliability were discussed. |
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| Keywords: | adhesive hermeticity reliability lid sealing processes |
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