| 镀Au键合Ag线性能对键合质量的影响研究 |
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| 引用本文： | 曹军,吴卫星.镀Au键合Ag线性能对键合质量的影响研究[J].材料科学与工艺,2018,26(6):30-35. |
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| 作者姓名： | 曹军 吴卫星 |
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| 作者单位： | 河南理工大学 机械与动力工程学院, 河南 焦作 454000,河南理工大学 机械与动力工程学院, 河南 焦作 454000 |
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| 基金项目： | 河南省科技攻关项目(152102210313). |
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| 摘 要： | 利用扫描电镜、能谱仪、拉力-剪切力测试仪等研究了不同镀Au厚度的镀Au键合Ag线Free Air Ball(FAB)特性和不同力学性能的镀Au键合Ag线对键合强度及其可靠性的影响规律，研究结果表明：镀Au键合Ag线镀层厚度过小会造成Electronic-Flame-Off(EFO)过程中的FAB偏球及球焊点形状不稳定，镀层厚度过大会导致FAB变尖；高强度、低伸长率会造成焊点颈部产生裂纹而造成焊点的拉力偏低并在颈部断裂，低强度、高伸长率引起颈部晶粒粗大进而降低颈部连接强度；镀Au键合Ag线颈部应力集中或内部组织结构不均匀，在冷热冲击周期性形变作用下，球焊点颈部产生裂纹并引起电阻增加，进而导致器件失效.
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| 关 键 词： | 镀层厚度 伸长率 拉断力 键合 可靠性 |
| 收稿时间： | 2017/10/9 0:00:00 |
Effects of Au coated Ag bonding wire properties on bonded quality |
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| CAO Jun and WU Weixing.Effects of Au coated Ag bonding wire properties on bonded quality[J].Materials Science and Technology,2018,26(6):30-35. |
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| Authors: | CAO Jun and WU Weixing |
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| Affiliation: | School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China and School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China |
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| Abstract: | The Au coated Ag bonding wire Free Air Ball(FAB) morphology with different Au coated thicknesses and bonded properties were analyzed by scanning electron microscope, strength tester, and energy dispersive spectrometer. Effects of different mechanical properties of Au coated Ag bonding wire on bonded strength and reliability were investigated. The results showed that small Au thickness could cause FAB after Electronic Flame Off(EFO) to form a Golf ball and the ball bonded would be astable, white large Au thickness caused sharp ball. High tensile strength and low elongation could cause micro-crack at the bonding neck and low ball bonded strength, White low tensile strength and high elongation caused large grain size and decreased the bonded strength. Cracks could be found in the ball neck and the conductor increased after thermalcycling because of stress concentration and inhomogeneity structures in ball neck for Au coated Ag bonding wire, and caused the device failure. |
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| Keywords: | Au thickness elongation tensile strength bonding reliability |
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