Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates期刊界 All Journals 搜尽天下杂志传播学术成果专业期刊搜索期刊信息化学术搜索

Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates

Authors:	S S Wang Y H Tseng T H Chuang

Affiliation:	(1) Department of Mechanical Engineering, De-Lin Institute of Technology, 236 Taipei, Taiwan;(2) Vishay General Semiconductor Taiwan Ltd., Hsin-Tien, 231 Taipei, Taiwan;(3) Institute of Materials Science and Engineering, National Taiwan University, 106 Taipei, Taiwan

Abstract:	The interfacial reactions between liquid In-49Sn solder and Ni substrates at temperatures ranging from 150°C to 450°C for 15 min to 240 min have been investigated. The intermetallic compounds formed at the In-49Sn/Ni interfaces are identified to be a ternary Ni₃₃In₂₀Sn₄₇ phase using electron-probe microanalysis (EPMA) and x-ray diffraction (XRD) analyses. These interfacial intermetallics grow with increasing reaction time by a diffusion-controlled mechanism. The activation energy calculated from the Arrhenius plot of reaction constants is 56.57 kJ/mol.

Keywords:	In-49Sn/Ni soldering reaction ternary Ni₃₃In₂₀Sn₄₇ intermetallics growth kinetics
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