| 国外MCM及其主要制造技术的发展现状 |
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| 引用本文： | 毅力.国外MCM及其主要制造技术的发展现状[J].微电子学,1993,23(5):1-10. |
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| 作者姓名： | 毅力 |
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| 作者单位： | 航空航天部六九一厂 陕西西安710054 |
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| 摘 要： | MCM具有胜过PCB、LSI和一般HIC的诸多优点,正在逢勃发展,可望成为九十年代的代表性技术。本文从市场和技术两个方面评述MCM的发展潜力,重点介绍近年来国外MCM主要制造技术的现状及发展态势,试图引起人们对它的关注。
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| 关 键 词： | 多芯片组件 功能模块 微型组件 |
Current Development of Multi-Chip-Modules and Its Manufacturing Technologies Abroad |
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| Yi Li
No. Factory. Ministry of Aeronrautics and Space,Xi'an.Shaanxi.Current Development of Multi-Chip-Modules and Its Manufacturing Technologies Abroad[J].Microelectronics,1993,23(5):1-10. |
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| Authors: | Yi Li
No Factory Ministry of Aeronrautics and Space Xi'anShaanxi |
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| Affiliation: | Yi Li
No. 691 Factory. Ministry of Aeronrautics and Space,710054,Xi'an.Shaanxi |
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| Abstract: | Multi-chip-modules,which have many advantages over PCB' s.LSI' s and common HIC' s.are vigorously developing and are expected to become one of the mainstream technologies in the 90' s. Potentials in the development of multi-chip-modules (MCMs)are reviewed in terms of the market and technologies. The emphasis is placed on the introduction of the current state of the main technologies for MCM' s abroad and their developing trends. |
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| Keywords: | Multi-chip-module High-performance HIC Functional module Hybrid microelectronics |
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