| 化学镀Ni-P合金镀液的稳定性研究 |
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| 引用本文： | 刘自力.化学镀Ni-P合金镀液的稳定性研究[J].昆明冶金高等专科学校学报,2003,19(2):15-17. |
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| 作者姓名： | 刘自力 |
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| 作者单位： | 昆明冶金高等专科学校,测绘与冶金工程系,云南,昆明,650033 |
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| 摘 要： | 镀液的稳定性是影响化学镀的成本．镀层质量、使用寿命和能否产业化等问题的重要因素。本文主要研究稳定剂、络合剂以及pH值和温度对镀液稳定性的影响规律，对化学镀过程的控制有一定的参考作用。
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| 关 键 词： | 化学镀 稳定性 稳定剂 络合剂 镀液 Ni－P合金 |
| 文章编号： | 1009-0479(2003)02-0015-03 |
Studies on the Solution's Stability of Electroless Plating Ni-P Alloy |
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| LIU Zi-li.Studies on the Solution''''s Stability of Electroless Plating Ni-P Alloy[J].Journal of Kunming Metallurgy College,2003,19(2):15-17. |
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| Authors: | LIU Zi-li |
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| Abstract: | During electroless plating, the stability of the solutions is the most important factor that influencescost, coating quality, service life and industrialization of electroless plating. The effects of stabilizing-agents,complex-agents, pH value and temperature on the stability of solution have been analyzed, which is helpful forthe process of electroless plating. |
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| Keywords: | electroless plating stability stabilizing-agent complex-agent |
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