| 压电陶瓷表面金属化工艺的改进 |
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| 引用本文： | 李学明,张轶群,陈伟.压电陶瓷表面金属化工艺的改进[J].电子元件与材料,2011,30(10):5-7. |
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| 作者姓名： | 李学明 张轶群 陈伟 |
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| 作者单位： | 浙江嘉康电子股份有限公司,浙江嘉兴,314000 |
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| 摘 要： | 分别采用磁控溅射技术及真空蒸发技术对压电陶瓷基片进行表面金属化处理,比较了该两种工艺对压电陶瓷基片表面金属电极的银层结合力、耐焊接热特性的影响.结果表明,较之真空蒸发技术,磁控溅射技术可使压电陶瓷基片表面金属电极的银层结合力提高103％,耐焊接热时间大于30 s;该技术还可提高压电陶瓷基片表面金属化的处理效率,使贵金属...
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| 关 键 词： | 磁控溅射 真空蒸发 表面金属化 |
Improvements in the surface metallization technique for piezoelectric ceramics |
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| LI Xueming,ZHANG Yiqun,CHEN Wei.Improvements in the surface metallization technique for piezoelectric ceramics[J].Electronic Components & Materials,2011,30(10):5-7. |
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| Authors: | LI Xueming ZHANG Yiqun CHEN Wei |
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| Affiliation: | LI Xueming,ZHANG Yiqun,CHEN Wei (Zhejiang Jiakang Electronics Co.,Ltd,Jiaxing 314000,Zhejiang Province,China) |
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| Abstract: | The surfaces of piezoelectric ceramic substrates were metalized using the magnetron sputtering and vacuum evaporation techniques.The effects of surface metallization technique on the bonding strength of silver layer and the ability to withstand soldering heat of the surface metal electrode of piezoelectric ceramic were studied.The results show that,compared with the vacuum evaporation technique,the magnetron sputtering technique increases the bonding strength of silver layer by 103% and the time to withstan... |
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| Keywords: | magnetron sputtering vacuum evaporation surface metallization |
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