| 气密性平行缝焊技术与工艺 |
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| 引用本文： | 王贵平,李晓燕.气密性平行缝焊技术与工艺[J].电子工艺技术,2014(1):42-44. |
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| 作者姓名： | 王贵平 李晓燕 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西太原030024 |
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| 摘 要： | 气密性封焊的产品因其杰出的可靠性被广泛应用于军事应用。与储能焊、激光焊相比,平行缝焊具有可靠性高、密封性能优越、运行成本低及生产率高等特点,是微电子器件最常用的气密性封装方法之一。主要阐述了气密性平行缝焊技术与工艺,并对焊接工艺参数进行了详细分析,同时给出了气密性检测要求及针对性措施。
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| 关 键 词： | 平行缝焊 气密性 封装 |
Technology and Process of Hermetic Parallel Seam Soldering |
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| WANG Gui-ping,LI Xiao-yan.Technology and Process of Hermetic Parallel Seam Soldering[J].Electronics Process Technology,2014(1):42-44. |
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| Authors: | WANG Gui-ping LI Xiao-yan |
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| Affiliation: | ( No.2 Research Institute of CETC, Taiyuan 030024, China ) |
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| Abstract: | The hermetic seam soldering products are widely used in military applications due to the outstanding reliability. Compared with the stored energy soldering, laser soldering, parallel seam soldering has a number of advantages including high reliability, hermetic sealing, low cost and high productivity, is one of the most commonly used seam soldering method in microelectronic device packaging. Mainly introduce technology and process of hermetic parallel seam soldering, analyze process parameter in detail, and provide hermetic testing demands and methods. |
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| Keywords: | Parallel seam soldering Hermetic sealing Packaging |
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