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DSC法测试PCB之乃的影响因素探讨
引用本文:陈小飞,方军良.DSC法测试PCB之乃的影响因素探讨[J].印制电路信息,2013(11):19-22,25.
作者姓名:陈小飞  方军良
作者单位:上海美维科技有限公司,上海201613
摘    要:在PCB行业中,DSC法主要用来测定PCB基板的玻璃化转变温度和固化度,运用DSC法测试PCB的Tg时,影响测试结果的因素有很多。文章重点对运用DSC法测试PCB的Tg过程中存在的影响因素分类进行讨论分析。

关 键 词:差示扫描量热法  玻璃化转变温度  影响因素

Discussion on the influence factors of using DSC to test Tg of PCB
Affiliation:CHEN Xiao-fei FANG Jung-jiang
Abstract:This paper mainly introduces DSC (differential scanning calorimeter), one of thermal analysis method. In the PCB industry, DSC technology is mainly used to test the glass transition temperature and curing degree of PCB, Using DSC method to test the glass transition temperature of PCB, there are many factors that influence the test result. This paper focuses on discussing and analyzing the influence factors which exists in the process of the test of glass transition temperature of PCB by DSC method.
Keywords:DSC  Tg  Influence Factor
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