| 稳定剂对低磷化学镀镍液及镀层的影响 |
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| 引用本文： | 郑振,李宁,黎德育.稳定剂对低磷化学镀镍液及镀层的影响[J].电镀与环保,2009,29(1). |
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| 作者姓名： | 郑振 李宁 黎德育 |
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| 作者单位： | 哈尔滨工业大学应用化学系,黑龙江,哈尔滨,150001 |
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| 摘 要： | 在基础低磷化学镀镍液中,分别添加硫脲(TU)、KI、KIO3、含硫有机杂环化合物A和CuSO4等稳定荆,考察其对镀液的稳定性能、镀速、镀层中磷的质量分数和可焊性等的影响.研究表明:化合物A的加入能使镀液稳定性上升,并且可以进一步降低镀层中磷的质量分数.合适稳定荆的加入,不但可以提高镀液的稳定性,同时还能够获得镀速更快、磷的质量分数更低,并且可焊性良好的低磷化学镀镍层.
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| 关 键 词： | 化学镀镍 低磷 稳定剂 可焊性 |
Effects of Stabilizers on Stability of Low-P Electroless Nickel Bath and Deposit |
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| ZHENG Zhen,LI Ning,LI De-yu.Effects of Stabilizers on Stability of Low-P Electroless Nickel Bath and Deposit[J].Electroplating & Pollution Control,2009,29(1). |
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| Authors: | ZHENG Zhen LI Ning LI De-yu |
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| Affiliation: | Department of Applied Chemistry;Harbin Institute of Technology;Harbin 150001;China |
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| Abstract: | To basic electroless nickel bath,five electroless nickel bath stabilizers of TU,KI,KIO_3,organic heterocyclic compound A containing sulfur,and CuSO_4 were added respectively,and the effects of these five stabilizers on the stability of electroless nickel bath,deposition rate,the mass fraction of P and soldering capability of the layer were investigated.The results show that A is an excellent electroless nickel bath stabilizer,which can not only stabilize the bath very well but also decrease the mass fractio... |
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| Keywords: | electroless nickel plating low-P: stabilizer soldering capability |
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