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部分脱胶压电复合材料层合梁黏结界面失效扩展有限元分析
引用本文:白瑞祥,王亮,石冶金,陈保兴.部分脱胶压电复合材料层合梁黏结界面失效扩展有限元分析[J].大连工业大学学报,2011,30(6):444-448.
作者姓名:白瑞祥  王亮  石冶金  陈保兴
作者单位:1. 大连理工大学工业装备结构分析国家重点实验室,辽宁大连,116024
2. 中国商飞上海飞机设计研究院强度设计研究部,上海,200232
基金项目:国家自然科学基金,中央高校基本科研业务费专项资金资助项目
摘    要:采用三维有限元模型,对在电场作用下部分脱胶的压电复合材料层合梁黏结界面损伤扩展行为进行了研究.建立了基于虚裂纹闭合技术(VCCT)的界面断裂单元,通过有限元软件ABAQUS的用户自定义单元功能UEL实现并计算了脱胶前缘的能量释放率GⅠ,GⅡ和GⅢ,采用B-K准则作为脱胶扩展判据.对部分脱胶的压电复合材料梁在电压作用下对...

关 键 词:压电驱动器  复合材料层合板  脱胶  3D-VCCT  能量释放率

Finite element analyses of interface delamination for 3D piezoelectric laminated beam with actuator debonding
BAI Rui-xiang,WANG Liang,SHI Ye-jin,CHEN Bao-xing.Finite element analyses of interface delamination for 3D piezoelectric laminated beam with actuator debonding[J].Journal of Dalian Dalian Polytechnic University,2011,30(6):444-448.
Authors:BAI Rui-xiang  WANG Liang  SHI Ye-jin  CHEN Bao-xing
Affiliation:1.State Key Laboratory of Structural Analysis for Industrial Equipment,Dalian University of Technology,Dalian 116024,China; 2.Stress Department,COMAC Shanghai Aircraft Design and Research Institute,Shanghai 200232,China)
Abstract:Three-dimensional non-linear finite element analyses have been carried out for piezoelectric laminated beams with piezoelectric actuator partially debonding subjected to applied voltage to study the growth of adhesion failure and delamination behavior.Based on VCCT,a fracture element,named as 3D-VCCT interface fracture element,was developed in conjunction with commercial FEA software ABAQUS by its user-defined element(UEL)feature.The three individual modes energy release rate was calculated with 3D-VCCT interface fracture element and the B-K criteria of delamination growth was used.The influence of the different ply angles of laminated beams and different thickness ratios of laminated beam on the delamination growth behavior was investigated.Based on the calculating results,it is found that the adhesion failure would propagate under mixed mode condition shearing mode of which was the governing mode.
Keywords:piezoelectric  laminated plate  debonding  3D-VCCT  energy release rate
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