Preparation, Microstructure, and Mechanical Properties of Silicon Carbide–Dysprosia Composites |
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Authors: | Shin Kim Waltraud M Kriven |
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Affiliation: | Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 |
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Abstract: | Composites of silicon carbide (SiC) with up to 30 vol% of dysprosia (Dy2O3) were fabricated by hot pressing and hot isostatic pressing. The effects of Dy2O3 dispersions on the microstructure and on selected mechanical properties of the composites were investigated. When 10-15 vol% of Dy2O3 was dispersed in the SiC matrix, the fracture toughness increased by ~40%, whereas the flexural strength was comparable to that of unreinforced SiC. The increased fracture toughness was due to crack deflection, in conjunction with crack-interface grain bridging, and was not related to a phase transformation of Dy2O3 in the matrix. |
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