AMOLED displays with transfer‐printed integrated circuits |
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Authors: | Ronald S. Cok John W. Hamer Christopher A. Bower Etienne Menard Salvatore Bonafede |
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Affiliation: | 1. Eastman Kodak Co., OLED Business Unit, Rochester, NY USA.;2. Semprius, Inc., 4915 Prospectus Dr., Suite C, Durham, NC 27713 USA. |
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Abstract: | Abstract— Small integrated circuits of crystalline silicon (chiplets) transfer‐printed onto a flat‐panel‐display substrate provide greatly improved electrical performance and uniformity in active‐matrix organic light‐emitting‐diode (OLED) displays. The integrated circuits are formed in high‐performance crystalline silicon using conventional photolithographic processes and then transfer‐printed onto a substrate using a stamp that transfers hundreds or thousands of chiplets at once. The chiplets are connected to an external controller and to pixel elements using conventional photolithographic substrate processing methods. Active‐matrix OLED (AMOLED) displays using transfer‐printed chiplets have good yields, excellent uniformity, and electrical performance and are thermally robust. |
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Keywords: | OLED organic light‐emitting diode flat panel active matrix display transfer printing chiplet pixel control uniformity |
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