| 我国微电子封装研发能力现状 |
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| 引用本文： | 肖力.我国微电子封装研发能力现状[J].电子与封装,2007,7(4):1-5,12. |
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| 作者姓名： | 肖力 |
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| 作者单位： | 中国电子科技集团公司第五十八研究所,江苏,无锡,214035 |
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| 摘 要： | 对从事微电子封装技术与培训、封装外壳与特种器件封装、封装设备、封装可靠性与标准化、封装材料、测试技术研发的科研院所进行了分析;对高等院校的微电子封装科研及人才培养机构进行了分析,对从事微电子封装研究、开发和服务的其他机构进行了分析。最后对我国封装研发和产业发展能力的培养进行了探讨。
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| 关 键 词： | 封装研发院所 封装培养高校 封装服务机构 |
| 文章编号： | 1681-1070（2007）04-0001-05 |
| 收稿时间： | 2006-03-16 |
| 修稿时间： | 2006年3月16日 |
The Actuality of Micro-electronics Packaging's Research Ability in China |
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| XIAO Li.The Actuality of Micro-electronics Packaging''''s Research Ability in China[J].Electronics & Packaging,2007,7(4):1-5,12. |
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| Authors: | XIAO Li |
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| Abstract: | This article analysed the academes which engage micro-electronic packaging and breed, packag- ing crust and special apparatus packaging, packaging equipments, packaging dependability and standardization, packaging materials, test technology’s research. Analysed the altitude academys’ foster frameworks of micro- electronic packaging research and persons with ability. Analysed the other frameworks which engage micro- electronic packaging research, empolder and service. And discussed the development ability of packaging re- search and industry in China. |
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| Keywords: | packaging research academy packaging foster academy packaging service frameworks |
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