| 基于正交试验的板级电路模块热分析 |
| |
| 引用本文： | 刘绪磊,周德俭,黄春跃,李永利.基于正交试验的板级电路模块热分析[J].电子元件与材料,2009,28(5). |
| |
| 作者姓名： | 刘绪磊 周德俭 黄春跃 李永利 |
| |
| 作者单位： | 1. 桂林电子科技大学,机电工程学院,广西,桂林,541004
2. 桂林电子科技大学,机电工程学院,广西,桂林,541004;广西工学院,机械工程系,广西,柳州,545006 |
| |
| 基金项目： | 广西研究生教育创新计划，广西研究生科研创新资助项目 |
| |
| 摘 要： | 利用ANSYS的APDL参数化编程语言,建立了灌封电路模块的有限元模型。选取挠性印制电路板(FPCB)厚度、上、下灌封体厚度、空气对流系数和环境温度等7个参数作为关键因素,安排正交试验。结果表明:上、下灌封体厚度等因素都对灌封电路模块工作温度有显著影响,其中空气对流系数的影响最为显著。初始设计的灌封电路模块工作温度为460.94K,通过增加灌封体的厚度,选择高热导率的灌封材料,保证良好的通风散热,控制环境温度,可以将模块的工作温度降到329.11K。
|
| 关 键 词： | 板级电路模块 热分析 正交试验 |
Thermal analysis for a board-level circuit module based on orthogonal test |
| |
| LIU Xulei,ZHOU Dejian,HUANG Chunyue,LI Yongli.Thermal analysis for a board-level circuit module based on orthogonal test[J].Electronic Components & Materials,2009,28(5). |
| |
| Authors: | LIU Xulei ZHOU Dejian HUANG Chunyue LI Yongli |
| |
| Affiliation: | 1. School of Mechanical & Electrical Engineering;Guilin University of Electronic Technology;Guilin 541004;Guangxi Zhuangzu Zizhiqu;China;2. Department of Mechanical Engineering;Guangxi University of Technology;Liuzhou 545006;China |
| |
| Abstract: | The finite element model of the perfusion circuit module was built by APDL based on ANSYS. The FPCB thickness, and the thicknesses of the upper and below potting module, the air convection coefficient, and the ambient temperature etc. were selected as seven key factors. The results show that the thickness of the upper and below potting module, etc. factors have remarkable efforts on the work temperature of the perfusion circuit module, especially the air convection coefficient is the most significant factor... |
| |
| Keywords: | board-level circuit module thermal analysis orthogonal test |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
